TC1302A_13 Datasheet, PDF (19/26 Pages) Microchip Technology – Low Quiescent Current Dual Output LDO

TC1302A/B
8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
TOP VIEW
D
EXPOSED
METAL
PAD
p
b
n
L
D2
21
E2
BOTTOM VIEW
PIN 1
ID INDEX
AREA
(NOTE 2)
A
A1
A3
EXPOSED
TIE BAR
(NOTE 1)
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Standoff
A1
Lead Thickness
A3
Overall Length
E
Exposed Pad Length ^{(Note 4)}
E2
Overall Width
D
Exposed Pad Width ^{(Note 4)}
D2
Lead Width
b
Lead Length
L
MIN
.031
.000
.055
.047
.007
.012
INCHES
NOM
8
.026 BSC
.035
.001
.008 REF.
.118 BSC
.118 BSC
.010
.019
MAX
.039
.002
.096
.069
.015
.022
MILLIMETERS*
MIN
NOM
8
0.65 BSC
0.80
0.90
0.00
0.02
0.20 REF.
3.00 BSC
1.39
3.00 BSC
1.20
0.23
0.26
0.30
0.48
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
4. Exposed pad dimensions vary with paddle size.
5. JEDEC equivalent: Pending
Drawing No. C04-062
MAX
1.00
0.05
2.45
1.75
0.37
0.55
 2003-2012 Microchip Technology Inc.
DS21333C-page 19