PIC16F882 Datasheet, PDF (273/288 Pages) Microchip Technology – 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F882/883/884/886/887
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
1 23
NOTE 2
A
α
c
φ
β
A1
A2
L
L1
Units
MILLIMETERS
Number of Leads
Lead Pitch
Dimension Limits
MIN
N
e
NOM
44
0.80 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Foot Length
A
–
–
1.20
A2
0.95
1.00
1.05
A1
0.05
–
0.15
L
0.45
0.60
0.75
Footprint
Foot Angle
Overall Width
L1
1.00 REF
φ
0°
3.5°
7°
E
12.00 BSC
Overall Length
Molded Package Width
D
12.00 BSC
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Notes:
Mold Draft Angle Bottom
β
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076B
© 2007 Microchip Technology Inc.
Preliminary
DS41291D-page 271