PIC16F882 Datasheet, PDF (270/288 Pages) Microchip Technology – 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F882/883/884/886/887
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
EXPOSED
D2
PAD
e
E
2
1
E2
2
1
b
K
N
TOP VIEW
NOTE 1
N
L
BOTTOM VIEW
A
A3
A1
Units
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
MIN
N
e
NOM
28
0.65 BSC
MAX
Overall Height
Standoff
Contact Thickness
Overall Width
A
0.80
0.90
1.00
A1
0.00
0.02
0.05
A3
0.20 REF
E
6.00 BSC
Exposed Pad Width
Overall Length
Exposed Pad Length
E2
3.65
3.70
4.70
D
6.00 BSC
D2
3.65
3.70
4.70
Contact Width
b
0.23
0.38
Contact Length
L
0.30
0.40
Notes:
Contact-to-Exposed Pad
K
0.20
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
0.43
0.50
–
Microchip Technology Drawing C04-124B
DS41291D-page 268
Preliminary
© 2007 Microchip Technology Inc.