PIC16F882 Datasheet, PDF (249/288 Pages) Microchip Technology – 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01 θJA
Thermal Resistance
Junction to Ambient
47.2
C/W 40-pin PDIP package
24.4
C/W 44-pin QFN package
45.8
C/W 44-pin TQFP package
60.2
C/W 28-pin PDIP package
80.2
C/W 28-pin SOIC package
89.4
C/W 28-pin SSOP package
29
C/W 28-pin QFN package
TH02 θJC
Thermal Resistance
Junction to Case
24.7
TBD
C/W 40-pin PDIP package
C/W 44-pin QFN package
14.5
C/W 44-pin TQFP package
29
C/W 28-pin PDIP package
23.8
C/W 28-pin SOIC package
23.9
C/W 28-pin SSOP package
TBD
C/W 28-pin QFN package
TH03 TJ
Junction Temperature
150
C For derated power calculations
TH04 PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation
—
W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/O
I/O Power Dissipation
—
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07 PDER
Derated Power
—
W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
Legend: TBD = To Be Determined.
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
© 2007 Microchip Technology Inc.
Preliminary
DS41291D-page 247