PIC16LF877A-I Datasheet, PDF (179/234 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers

PIC16F87XA
17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended)
PIC16LF873A/874A/876A/877A (Industrial) (Continued)
PIC16LF873A/ 874A/ 876A/ 877A
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC16F873A/ 874A/ 876A/ 877A
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ† Max Units
Conditions
IPD
Power-down Current^(3,5)
D020
16LF87XA — 7.5 30 µA VDD = 3.0V, WDT enabled,
-40°C to +85°C
D020
16F87XA — 10.5 42
60
µA VDD = 4.0V, WDT enabled,
-40°C to +85°C
µA VDD = 4.0V, WDT enabled,
-40°C to +125°C (extended)
D021
16LF87XA — 0.9
5
µA VDD = 3.0V, WDT disabled,
0°C to +70°C
D021
16F87XA — 1.5 16 µA VDD = 4.0V, WDT disabled,
-40°C to +85°C
20 µA VDD = 4.0V, WDT disabled,
-40°C to +125°C (extended)
D021A
16LF87XA
0.9
5
µA VDD = 3.0V, WDT disabled,
-40°C to +85°C
D021A
16F87XA
1.5 19 µA VDD = 4.0V, WDT disabled,
-40°C to +85°C
D023
∆IBOR Brown-out
Reset Current⁽⁶⁾
— 85 200 µA BOR enabled, VDD = 5.0V
Legend: Rows with standard voltage device data only are shaded for improved readability.
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
 2003 Microchip Technology Inc.
DS39582B-page 177