PIC16F819T-E Datasheet, PDF (160/176 Pages) Microchip Technology – 18/20-Pin Enhanced Flash Microcontrollers with nanoWatt Technology

PIC16F818/819
18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
E1
D
2
n
1
α
E
A2
A
c
β
eB
A1
B1
B
L
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
18
p
.100
18
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
Molded Package Width
E1
.240
.250
.260
6.10
6.35
Overall Length
D
.890
.898
.905
22.61
22.80
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
Lead Thickness
c
.008
.012
.015
0.20
0.29
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
Lower Lead Width
B
.014
.018
.022
0.36
0.46
Overall Row Spacing
§
eB
.310
.370
.430
7.87
9.40
Mold Draft Angle Top
α
5
10
15
5
10
Mold Draft Angle Bottom
β
5
10
15
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
MAX
4.32
3.68
8.26
6.60
22.99
3.43
0.38
1.78
0.56
10.92
15
15
DS39598E-page 158
 2004 Microchip Technology Inc.