MLX90316KDC-BDG Datasheet, PDF (6/45 Pages) Melexis Microelectronic Systems – Rotary Position Sensor IC

MLX90316
Rotary Position Sensor IC
15. MLX90316 SELF DIAGNOSTIC.......................................................................................................... 28
16. SERIAL PROTOCOL........................................................................................................................... 30
16.1. INTRODUCTION .........................................................................................................................................30
16.2. SERIAL PROTOCOL MODE ...................................................................................................................30
16.3. MOSI (MASTER OUT SLAVE IN) ...............................................................................................................30
16.4. MISO (MASTER IN SLAVE OUT) ...............................................................................................................30
16.5. SS (SLAVE SELECT) ..................................................................................................................................30
16.6. MASTER START-UP ...................................................................................................................................30
16.7. SLAVE START-UP......................................................................................................................................30
16.8. TIMING......................................................................................................................................................31
16.9. SLAVE RESET ............................................................................................................................................32
16.10. FRAME LAYER ..........................................................................................................................................32
16.10.1. Command Device Mechanism ..........................................................................................................32
16.10.2. Data Frame Structure ......................................................................................................................32
16.10.3. Timing...............................................................................................................................................32
16.10.4. Data Structure ..................................................................................................................................33
16.10.5. Angle Calculation.............................................................................................................................33
16.10.6. Error Handling.................................................................................................................................33
17. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 34
17.1. ANALOG OUTPUT WIRING WITH THE MLX90316 IN SOIC PACKAGE.......................................................34
17.2. ANALOG OUTPUT WIRING WITH THE MLX90316 IN TSSOP PACKAGE....................................................35
17.3. PWM LOW SIDE OUTPUT WIRING ............................................................................................................35
17.4. SERIAL PROTOCOL ....................................................................................................................................36
17.4.1. SPI Version – Single Die ......................................................................................................................36
17.4.2. SPI Version – Dual Die ........................................................................................................................37
17.4.3. Non SPI Version (Standard Version)....................................................................................................38
18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 39
19. ESD PRECAUTIONS........................................................................................................................... 39
20. PACKAGE INFORMATION.................................................................................................................. 40
20.1.
20.2.
20.3.
20.4.
20.5.
20.6.
SOIC8 - PACKAGE DIMENSIONS ...............................................................................................................40
SOIC8 - PINOUT AND MARKING ...............................................................................................................40
SOIC8 - IMC POSITIONNING.....................................................................................................................41
TSSOP16 - PACKAGE DIMENSIONS ..........................................................................................................42
TSSOP16 - PINOUT AND MARKING ..........................................................................................................43
TSSOP16 - IMC POSITIONNING................................................................................................................43
21.DISCLAIMER………………………………………………………………………………………………........45
3901090316
Rev10
Page 6 of 45
Jul/13