MAX16067 Datasheet, PDF (2/47 Pages) Maxim Integrated Products – 6-Channel, Flash-Configurable System Manager with Nonvolatile Fault Registers

6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
ABSOLUTE MAXIMUM RATINGS
VCC to GND...............……………………………….-0.3V to +15V
MON_, SCL, SDA, A0 to GND.................................-0.3V to +6V
EN, TCK, TMS, TDI to GND.....................................-0.3V to +4V
TDO to GND.............................................-0.3V to (VDBP + 0.3V)
EN_OUT1, EN_OUT2, EN_OUT3
(configured as open-drain) to GND...................-0.3V to +15V
EN_OUT1, EN_OUT2, EN_OUT3
(configured as charge pump) to GND..............-0.3V to +15V
EN_OUT4, EN_OUT5, EN_OUT6, RESET, GPIO_
(configured as open-drain) to GND.....................-0.3V to +6V
EN_OUT_, RESET, GPIO_ (configured as push-pull)
to GND..................................................-0.3V to (VDBP + 0.3V)
*As per JEDEC 51 Standard, Multilayer Board (PCB).
DBP, ABP to GND........................................-0.3V to minimum of
(4V and (VCC + 0.3V))
Continuous Current (all other pins).................................. Q20mA
Continuous Current (GND, pin 5).................................... Q30mA
Continuous Power Dissipation (TA = +70NC)
32-Pin TQFN (derate 34.5mW/NC above +70NC)..... 2759mW*
Thermal Resistance (Note 1)
BJA................................................................................29NC/W
B_JC..................................................................................2NC/W
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = 2.8V to 14V, TA = TJ = -40NC to +85NC, unless otherwise specified. Typical values are at VABP = VDBP = VCC = 3.3V,
TA = +25NC.) (Note 2)
PARAMETER
Operating Voltage Range
SYMBOL
CONDITIONS
RESET output asserted low
VCC
MIN TYP MAX UNITS
1.2
V
2.8
14
Undervoltage Lockout
VUVLO
Minimum voltage on VCC to ensure the
device is flash configurable
2.7
V
Undervoltage Lockout Hysteresis UVLOHYS
55
mV
Minimum Flash Operating Voltage
VFLASH
Minimum voltage on VCC to ensure flash
erase and write operations
2.7
V
Supply Current
ICC1
ICC2
No load on any output
No load on any output, during flash writing
cycle
2.8
4
7.7
14
mA
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
Flash Writing Time
Internal Timing Accuracy
ADC
Resolution
Gain Error
Offset Error
Integral Nonlinearity
VDBP
VABP
tBOOT
VCC = VABP = VDBP = 3.6V (Note 3)
VCC = 5V, CDBP = 1FF, no load
VCC = 5V, CABP = 1FF, no load
VCC > VUVLO
8-byte word
(Note 4)
ADCGAIN
ADCOFF
ADCINL
TA = +25NC
TA = -40NC to +85NC
5
2.8
3
3.2
V
2.85
3
3.15
V
100 200
Fs
122
ms
-10
+10
%
10
Bits
0.35
%
0.75
1.50 LSB
1
LSB
2   _______________________________________________________________________________________