MAZS360GML Datasheet, PDF (16/22 Pages) Tyco Electronics – Telecommunications & Networking Devices

Agency Recognition for Telecommunications and Networking Devices
UL
File # E74889
CSA
File #78165C
TÜV
Per IEC60730-1
Certificate # for individual products available upon request.
Recommended Pad Layouts for Surface-mount Telecommunications and Networking
Table T7
Devices in millimeters (inches) Nominal
Device
TS250 (All)
TSV250 (All)
TSL250 (All)
TS600 (All)
TSM600 (All)
A
4.60
(0.180)
2.29
(0.090)
3.60
(0.140)
10.42
(0.410)
5.20
(0.205)
B
1.80
(0.070)
2.41
(0.095)
1.80
(0.070)
3.30
(0.130)
17.80
(0.701)
C
6.10
(0.240)
6.35
(0.250)
5.50
(0.220)
3.35
(0.132)
5.54
(0.218)
D
—
—
3.43
(0.135)
—
—
—
—
6.75
(0.266)
E
—
—
—
—
—
—
—
—
2.08
(0.082)
F
—
—
—
—
—
—
—
—
3.12
(0.123)
G
—
—
—
—
—
—
—
—
8.39
(0.331)
Figure
T18
T19
T18
T18
T20
Figure T18
Figure T19
Figure T20
A
B
C
B
A
B
C
D
A
B
B
A
C
D
EG
F
12
228
Solder Reflow and Rework Recommendations for Telecommunications Surface-mount Devices
Profile Feature
Pb-Free Assembly
Average ramp up rate (Ts_MAX to Tp)
Preheat
3°C/second max.
• Temperature min. (Ts_MIN)
• Temperature max. (Ts_MAX)
• Time (ts_MIN to ts_MAX)
Time maintained above:
150°C
200°C
60-180 seconds
• Temperature (T_L)
• Time (t_L)
Peak/Classification temperature (Tp)
217°C
60-150 seconds
260°C
Time within 5°C of actual peak temperature
Time (tp)
20-40 seconds
Ramp down rate
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Figure T21
Tp
T
L Ts
MAX
Ts
MIN
25
Reflow Profile
tp
Ramp up
t_L
Critical Zone
T to Tp
L
ts
Preheat
Ramp down
t 25˚C to Peak
Time
Solder Reflow
• Recommended reflow method: IR, vapor phase oven, hot air oven.
• Surface-mount devices are not designed to be wave soldered to the bottom side of the board.
• Recommended maximum paste thickness of 0.25mm (0.010 in).
• Devices can be cleaned using standard industry methods and solvents.
Rework
• If a device is removed from the board, it should be discarded and replaced with a new device.
RoHS compliant, ELV compliant