BTM510 Datasheet, PDF (5/23 Pages) Vishay Siliconix – Metallized Polyester Film Capacitors MKT Radial Potted Type

BTM510/511 Multimedia Module
Datasheet
2 SPECIFICATIONS
2.1 Detailed Specifications
Table 1: Detailed specifications
Categories
Wireless Specification
Feature
Standards Supported
Transmit Class
Frequency
Channels
Antenna Modes
UART Interface
General Purpose
Interface
Audio
Protocols and Firmware
Maximum Transmit
Power
Minimum Transmit
Power
Receive Sensitivity
Data Transfer Rate
Range
External Antenna
Integrated Antenna
Serial Interface
Baud Rate
Bits
Parity
Stop bits
Default Serial
parameters
Levels
Modem Control
I/O
I2S
LED
Codec
Amplifiers
Microphone
Sample Rates
(DAC and ADC)
Bluetooth® Stack
Profiles
Protocols
Implementation
Bluetooth^® v3.0
Class 2
2.402 – 2.480 GHz
79 channels Frequency Hopping Adaptive Frequency
Hopping
+4 dBm @ antenna pad – BTM510
+4 dBmi from integrated antenna – BTM511
-27 dBm @ antenna pad – BTM510
-27 dBmi from integrated antenna – BTM511
Better than -86 dBm
Up to 300 kbps
Up to 30 meters
50 Ohm matched SMT pad – BTM510
+0 dB multilayer ceramic – BTM511
RS-232 bi-directional for commands and data
16550 compatible
Configurable from 1,200 to 921,600 bps
Non-standard baud rates supported
8
Odd, even, none
1 or 2
9600,n,8,1
4 general purpose I/O pins
Stereo Audio Digital Interface Bus
2
Integrated stereo codec with -95 dB SNR for DAC
Direct drive for 16 Ω Speakers
Input for low noise microphone
8, 11.025, 16, 22.05, 32 & 44.1kHz
V3.0 compliant. Fully integrated.
GAP Generic Access Profile
SDP Service Discovery Profile
SPP Serial Port Profile
HSP – Audio Gateway and Headset unit
HFP v1.6 – Audio Gateway and Handsfree
A2DP – Source and Sink
AVRCP v1.5 – Target and Controller
RFCOMM
AVCTP
AVDTP
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/ramp
5
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