BTM510 Datasheet, PDF (4/23 Pages) Vishay Siliconix – Metallized Polyester Film Capacitors MKT Radial Potted Type

BTM510/511 Multimedia Module
Datasheet
1 OVERVIEW
The BTM510 and BTM511 are low-power Bluetooth® modules designed for adding robust audio and voice
capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide
exceptionally low power consumption with outstanding range. Supporting Bluetooth v3.0 specification, these
modules provide the important advantage of secure simple pairing that improves security and enhances easy
use.
At only 14 mm x 20 mm, the compact size of the BTM510 is ideal for battery-powered or headset form factor
audio and voice devices. With a 16-bit stereo codec and microphone inputs to support both stereo and mono
applications, these modules also contain a full, integrated Bluetooth-qualified stack along with SPP, HFP 1.6,
HSP, AVRCP v1.5, and A2DP profiles.
The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05. This is integrated
with the Bluetooth functionality which allows designers to add significant product enhancements including
features such as echo cancellation, noise reduction, and audio enhancement using additional soft codecs. The
availability of the 16MB of flash memory in the module allows complex functionality to be included. DSP
routines can be licensed through a number of specialist partners. Typical applications for these modules include
Bluetooth stereo headsets, VoIP phones, and wireless audio links.
To speed product development and integration, Laird Technologies has developed a comprehensive AT
command interface that simplifies application development, including support for audio and headset
functionality. Access to GPIO pins allows mapping for direct connection to actuator buttons on headsets.
Combined with a low-cost development kit, Laird Technologies’ Bluetooth® modules provide faster time to
market.
Features
 Fully featured Bluetooth® multimedia module
 Bluetooth® v3.0 (FW v22.2.5.0 onwards)
 Supports mono and stereo headset applications
 Adaptive Frequency Hopping to cope with interference
from other wireless devices
 32-bit Kalimba DSP for enhanced audio applications
 Support for Secure Simple Pairing
 External or internal antenna options
 HSP, HFP, A2DP, and AVRCP audio profiles
 16-bit stereo codec and microphone input
 Integrated audio amplifiers for driving stereo speaker
 Comprehensive AT interface for simple programming
 Bluetooth END product qualified
 Compact size
 Class 2 output – 4 dBm
 Low power operation
 Wi-Fi co-existence hardware support
Application Areas
 High-quality stereo headsets
 Mono voice headsets
 Hands-free devices
 Wireless audio cable replacement
 MP3 and music players
 Phone accessories
 VoIP products
 Cordless headsets
 Automotive
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/ramp
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