BTM510 Datasheet, PDF (21/23 Pages) Vishay Siliconix – Metallized Polyester Film Capacitors MKT Radial Potted Type

BTM510/511 Multimedia Module
Datasheet
7.3 Reflow Parameters
Laird surface mount modules are designed to be easily manufactured including reflow soldering to a PCB. It is
the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures
during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform to J-STD-
020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Target Profile
Soak Min
Soak Max
Liquidous
Lower Target
Upper Target
Absolute Peak
Figure 6: Recommended reflow temperature
Temperatures should not exceed the minimums or maximums presented in Table 7-1: Recommended maximum
and minimum temperatures.
Table 7-1: Recommended maximum and minimum temperatures
Specification
Temperature Inc./Dec. Rate (max)
Temperature Decrease rate (goal)
Soak Temp Increase rate (goal)
Flux Soak Period (min)
Flux Soak Period (max)
Flux Soak Temp (min)
Flux Soak Temp (max)
Time Above Liquidous (max)
Time Above Liquidous (min)
Time In Target Reflow Range (goal)
Time At Absolute Peak (max)
Liquidous Temperature (SAC305)
Lower Target Reflow Temperature
Upper Target Reflow Temperature
Absolute Peak Temperature
Value
3
2-3
.5 - 1
60
90
150
190
60
20
30
30
217
225
250
260
Unit
°C / Sec
°C / Sec
°C / Sec
Sec
Sec
°C
°C
Sec
Sec
Sec
Sec
°C
°C
°C
°C
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http://ews-support.lairdtech.com
www.lairdtech.com/ramp
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