LTC3862 Datasheet, PDF (39/40 Pages) Linear Technology – Multi-Phase Current Mode Step-Up DC/DC Controller

PACKAGE DESCRIPTION
UH Package
24-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1747 Rev A)
LTC3862
0.75 p0.05
5.40 p0.05
3.90 p0.05
3.25 REF
3.20 p 0.05
3.20 p 0.05
PACKAGE OUTLINE
0.30 p 0.05
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 p 0.10
0.75 p 0.05
PIN 1
TOP MARK
(NOTE 6)
5.00 p 0.10
R = 0.05
TYP
0.00 – 0.05
3.25 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.150
TYP
23 24
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
0.55 p 0.10
1
2
3.20 p 0.10
3.20 p 0.10
0.200 REF
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UH24) QFN 0708 REV A
0.30 p 0.05
0.65 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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