LTC3862 Datasheet, PDF (38/40 Pages) Linear Technology – Multi-Phase Current Mode Step-Up DC/DC Controller

LTC3862
PACKAGE DESCRIPTION
FE Package
24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation AA
3.25
(.128)
7.70 – 7.90*
(.303 – .311)
3.25
(.128)
24 23 22 21 20 19 18 17 16 15 14 13
6.60 p0.10
4.50 p0.10
SEE NOTE 4
2.74
(.108)
0.45 p0.05
1.05 p0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0o – 8o
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE24 (AA) TSSOP 0208 REV Ø
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
GN Package
24-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.337 – .344*
(8.560 – 8.738)
.045 p.005
24 23 22 21 20 19 18 17 16 15 1413
.033
(0.838)
REF
.254 MIN
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 p.0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.015 p .004
(0.38 p 0.10)
s 45o
.0075 – .0098
(0.19 – 0.25)
0o – 8o TYP
1 2 3 4 5 6 7 8 9 10 11 12
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN24 (SSOP) 0204
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