LTC3618_15 Datasheet, PDF (22/24 Pages) Linear Technology – Dual 4MHz, 3A Synchronous Buck Converter for DDR Termination

LTC3618
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UF Package
24²⁴-₍L^-_R^Le_e^ea_fe^ad_r^d_eP_n^Pl_ca^l_e^aUs_L^stF_T^tiⁱ_Cc^cP_DQa^Q_W^cFFkN_G^Na_#(g⁽4^4e₀m^m_5-m^m_08-^××₁₆⁴4₉^mm₇^m₎m⁾)
(Reference LTC DWG # 05-08-1697 Rev B)
0.70 ±0.05
4.50 ±0.05
2.45 ±0.05
3.10 ±0.05 ^{(4 SIDES)}
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ±0.05
2.45 ±0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
0.40 ±0.10
1
2
(UF24) QFN 0105 REV B
0.200 REF
0.25 ±0.05
0.00 – 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3618fc
22
For more information www.linear.com/LTC3618