LTC3618_15 Datasheet, PDF (21/24 Pages) Linear Technology – Dual 4MHz, 3A Synchronous Buck Converter for DDR Termination

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA
LTC3618
3.25
(.128)
7.70 – 7.90*
(.303 – .311)
3.25
(.128)
24 23 22 21 20 19 18 17 16 15 14 13
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE24 (AA) TSSOP REV B 0910
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
For more information www.linear.com/LTC3618
3618fc
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