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LTC3854_15 Datasheet, PDF (18/28 Pages) Linear Technology – Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller
LTC3854
APPLICATIONS INFORMATION
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. If the ratio of
CLOAD to COUT is greater than 1:50, the switch rise time
should be controlled so that the load rise time is limited
to approximately 25 • CLOAD. Thus a 10μF capacitor would
require a 250μs rise time, limiting the charging current
to about 200mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3854. These items are also illustrated graphically
in the layout diagram of Figure 4. Check the following in
your layout:
1) Are the signal and power grounds segregated? The
LTC3854 GND pin should tie to the ground plane close
to the output capacitor(s). The low current or signal
ground trace should make a single point connection
directly to the GND pin. The synchronous MOSFET
source pins should connect to the input capacitor(s)
ground.
2) Does the VFB pin connect directly to the feedback resis-
tors? The resistive divider R1, R2 must be connected
between the (+) plate of COUT and signal ground. The
47pF to 100pF capacitor should be as close as possible
to the LTC3854. Be careful locating the feedback resis-
tors too far away from the LTC3854. The VFB line should
not be routed close to any other nodes with high slew
rates.
+
6
SW
LTC3854
5
TG
M1
CIN
+
CSS
3
4
RUN/SS BOOST
RC CC
CC2
2
10
VIN
ITH
VIN
47pF
DB
CB
1
9
D1
VFB
INTVCC
11 SENSE–
8
BG
+
4.7µF
M2
1000pF
12 SENSE+
7
GND
–
R1
COUT
R2
L1
RSENSE
–
VOUT
+
3854 F04
Figure 4. LTC3854 Layout Diagram
3854fb
18