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80VA Datasheet, PDF (10/27 Pages) Lattice Semiconductor – In-System Programmable 3.3V Generic Digital CrosspointTM
Specifications ispGDX80VA
DC Electrical Characteristics for 2.5V Range
Over Recommended Operating Conditions
SYMBOL
PARAMETER
VCCIO I/O Reference Voltage
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
VOH
Output High Voltage
CONDITION
–
VOH(MIN) ≤ VOUT or VOUT ≤ VOL(MAX)
VOH(MIN) ≤ VOUT or VOUT ≤ VOL(MAX)
VCCIO=MIN, IOL = 100µA
VCCIO=MIN, IOL = 8mA
VCCIO=MIN, IOH = -100µA
VCCIO=MIN, IOH = -8mA
MIN.
2.3
-0.3
1.7
–
–
2.1
1.8
TYP.
–
–
–
–
–
–
–
MAX. UNITS
2.7
V
0.7
V
5.25 V
0.2
V
0.6
V
–
V
–
V
2.5V/gdxva
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL
PARAMETER
IIL
Input or I/O Low Leakage Current
IIH
Input or I/O High Leakage Current
IPU
IBHLS
IBHHS
IBHLO
IBHHO
IBHT
IOS1
ICCQ4
ICC
I/O Active Pullup Current
Bus Hold Low Sustaining Current
Bus Hold High Sustaining Current
Bus Hold Low Overdrive Current
Bus Hold High Overdrive Current
Bus Hold Trip Points
Output Short Circuit Current
Quiescent Power Supply Current
Dynamic Power Supply Current
per Input Switching
CONDITION
0V ≤ VIN ≤ VIL (MAX)
(VCCIO-0.2) ≤ VIN ≤ VCCIO
VCCIO ≤ VIN ≤ 5.25V
0V ≤ VIN ≤ VIL (MAX)
VIN = VIL (MAX)
VIN = VIH (MIN)
0V ≤ VIN ≤ VCCIO
0V ≤ VIN ≤ VCCIO
VCC = 3.3V, VOUT = 0.5V, TA = 25°C
VIL = 0.5V, VIH = VCC
One input toggling at 50% duty cycle,
outputs open.
MIN.
–
–
–
–
40
-40
–
–
VIL
–
–
–
TYP.2 MAX.
–
-10
–
10
–
50
– -200
–
–
–
–
– 550
– -550
–
VIH
– -250
12
–
See –
Note 3
UNITS
µA
µA
µA
µA
µA
µA
µA
µA
V
mA
mA
mA/
MHz
ICONT 5
Maximum Continuous I/O Pin Sink
Current Through Any GND Pin
–
–
– 160 mA
1. One output at a time for a maximum of one second. VOUT = 0.5V was selected to avoid test problems by
tester ground degradation. Characterized, but not 100% tested.
DC Char_gdx80va
2. Typical values are at VCC = 3.3V and TA = 25°C.
3. ICC / MHz = (0.002 x I/O cell fanout) + 0.022.
e.g. An input driving four I/O cells at 40MHz results in a dynamic ICC of approximately ((0.002 x 4) + 0.022) x 40 = 1.20mA.
4. For a typical application with 50% of I/O pins used as inputs, 50% used as outputs or bi-directionals.
5. This parameter limits the total current sinking of I/O pins surrounding the nearest GND pin.
10