T541D157M10AH6510 Datasheet, PDF (15/23 Pages) Kemet Corporation – T540/T541 COTS Polymer Electrolytic for High Reliability Applications, 2.5 - 63 VDC

KEMET Organic Capacitor (KO-CAP^®) – High Reliability
T540/T541 COTS Polymer Electrolytic for High Reliability Applications, 2.5 – 63 VDC
Soldering Process
KEMET’s families of surface mount capacitors are
compatible with wave (single or dual), convection, IR,
or vapor phase reflow techniques. Preheating of these
components is recommended to avoid extreme thermal
stress. KEMET's recommended profile conditions for
convection and IR reflow reflect the profile conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
The devices can safely withstand a maximum of three reflow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstand wave soldering, the tall profile (4.3 mm maximum)
dictates care in wave process development.
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T_Smin)
100°C
Temperature Maximum (T_Smax)
150°C
Time (t_s) from T_smin to T_smax)
60 – 120 seconds
Ramp-up Rate (T_L to T_P) 3°C/seconds maximum
Liquidous Temperature (T_L)
183°C
Time Above Liquidous (t_L)
Peak Temperature (T_P)
60 – 150 seconds
220°C*
235°C**
Time within 5°C of Maximum
Peak Temperature (t_P)
20 seconds maximum
Ramp-down Rate (T_P to T_L) 6°C/seconds maximum
Time 25°C to Peak
Temperature
6 minutes maximum
150°C
200°C
60 – 120 seconds
3°C/seconds maximum
217°C
60 – 150 seconds
250°C*
260°C**
30 seconds maximum
6°C/seconds maximum
8 minutes maximum
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reflow occurs. Once reflow occurs, the iron should be
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
T_{P Maximum Ramp Up Rate = 3ºC/sec}
t_P
Maximum Ramp Down Rate = 6ºC/sec
T_L
t_L
T_smax
During typical reflow operations, a slight darkening of the
T_smin
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
25
t_s
25ºC to Peak
Time
Storage
All KO-Cap Series are shipped in moisture barrier bags (MBBs) with desiccant and humidity indicator card (HIC).
These parts are classified as MSL3 (Moisture Sensitivity Level 3) per IPC/JEDEC J-STD-020 and packaged per
IPC/JEDEC J-STD-033.
MSL3 specifies a floor time of 168H at 30ºC maximum temperature and 60% relative humidity
Unused capacitors should be sealed in a MBB with fresh desiccant.
Calculated shelf life in sealed bag:
– 12 months from bag seal date in a storage environment of < 40ºC and humidity < 90% RH
– 24 months from bag seal date in a storage environment of < 30ºC and humidity < 70% RH
If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2077_T540-541 • 11/29/2016 15