T541D157M10AH6510 Datasheet, PDF (14/23 Pages) Kemet Corporation – T540/T541 COTS Polymer Electrolytic for High Reliability Applications, 2.5 - 63 VDC

KEMET Organic Capacitor (KO-CAP^®) – High Reliability
T540/T541 COTS Polymer Electrolytic for High Reliability Applications, 2.5 – 63 VDC
Table 2 – Land Dimensions/Courtyard
Metric
KEMET Size
Code
Case
EIA
A
3216–18
B
3528–21
C
6032–25
D
7343–31
L
6032-19
M
3528-15
H
7360-20
E¹ 7360–38
Q
7343-12
R²
2012-12
S2 3216–12
T
3528–12
U
6032–15
V
7343–20
W
7343–15
X¹ 7343–43
Y¹ 7343–40
Density Level A:
Maximum (Most) Land
Protrusion (mm)
W
L
S V1 V2
1.35 2.20 0.62 6.02 2.80
2.35 2.21 0.92 6.32 4.00
2.35 2.77 2.37 8.92 4.50
2.55 2.77 3.67 10.22 5.60
2.35 2.77 2.37 8.92 4.50
2.35 2.20 0.92 6.32 4.00
4.25 2.77 3.67 10.22 7.30
4.25 2.77 3.67 10.22 7.30
2.55 2.77 3.67 10.22 5.60
1.05 1.83 0.15 4.82 2.50
1.35 2.20 0.62 6.02 2.80
2.35 2.20 0.92 6.32 4.00
2.35 2.77 2.37 8.92 4.50
2.55 2.77 3.67 10.22 5.60
2.55 2.77 3.67 10.22 5.60
2.55 2.77 3.67 10.22 5.60
2.55 2.77 3.67 10.22 5.60
Density Level B:
Median (Nominal) Land
Protrusion (mm)
W
L
S V1 V2
1.23 1.80 0.82 4.92 2.30
2.23 1.80 1.12 5.22 3.50
2.23 2.37 2.57 7.82 4.00
2.43 2.37 3.87 9.12 5.10
2.23 2.37 2.57 7.82 4.00
2.23 1.80 1.12 5.22 3.50
4.13 2.37 3.87 9.12 6.80
4.13 2.37 3.87 9.12 6.80
2.43 2.37 3.87 9.12 5.10
0.93 1.50 0.22 3.72 2.00
1.23 1.80 0.82 4.92 2.30
2.23 1.80 1.12 5.22 3.50
2.23 2.37 2.57 7.82 4.00
2.43 2.37 3.87 9.12 5.10
2.43 2.37 3.87 9.12 5.10
2.43 2.37 3.87 9.12 5.10
2.43 2.37 3.87 9.12 5.10
Density Level C:
Minimum (Least) Land
Protrusion (mm)
W
L
S V1 V2
1.13 1.42 0.98 4.06 2.04
2.13 1.42 1.28 4.36 3.24
2.13 1.99 2.73 6.96 3.74
2.33 1.99 4.03 8.26 4.84
2.13 1.99 2.73 6.96 3.74
2.13 1.42 1.28 4.36 3.24
4.03 1.99 4.03 8.26 6.54
4.03 1.99 4.03 8.26 6.54
2.33 1.99 4.03 8.26 4.84
0.83 1.12 0.38 2.86 1.74
1.13 1.42 0.98 4.06 2.04
2.13 1.42 1.28 4.36 3.24
2.13 1.99 2.73 6.96 3.74
2.33 1.99 4.03 8.26 4.84
2.33 1.99 4.03 8.26 4.84
2.33 1.99 4.03 8.26 4.84
2.33 1.99 4.03 8.26 4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
1 _{Height of these chips may create problems in wave soldering.}
2 _{Land pattern geometry is too small for silkscreen outline.}
V1
L
L
W
W
V2
S
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2077_T540-541 • 11/29/2016 14