IS63LV1024_07 Datasheet, PDF (16/18 Pages) Integrated Silicon Solution, Inc – 128K x 8 HIGH-SPEED CMOS STATIC RAM 3.3V REVOLUTIONARY PINOUT

PACKAGING INFORMATION
Plastic STSOP - 32 pins
Package Code: H (Type I)
A2
A
A1
1
N
E
b
e
D1
S
SEATING PLANE
D
Plastic STSOP (H - Type I)
Millimeters
Inches
Symbol Min Max
Min Max
Ref. Std.
N
32
A — 1.25
— 0.049
A1 0.05 —
0.002 —
A2 0.95 1.05
0.037 0.041
b 0.17 0.23
0.007 0.009
C 0.14 0.16
0.0055 0.0063
D 13.20 13.60
0.520 0.535
D1 11.70 11.90
0.461 0.469
E 7.90 8.10
0.311 0.319
e 0.50 BSC
0.020 BSC
L 0.30 0.70
0.012 0.028
S 0.28 Typ.
α 0° 5°
0.011 Typ.
0°
5°
Integrated Silicon Solution, Inc.
PK13197H32 Rev. B 04/21/03
L
α
C
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.