IS63LV1024_07 Datasheet, PDF (14/18 Pages) Integrated Silicon Solution, Inc – 128K x 8 HIGH-SPEED CMOS STATIC RAM 3.3V REVOLUTIONARY PINOUT

PACKAGING INFORMATION
300-mil Plastic SOJ
Package Code: J
N
E1 E
1
D
SEATING PLANE
A
B
A2
C
e
b
A1
E2
MILLIMETERS
Sym. Min. Typ. Max.
N0.
Leads
24/26
A
— — 3.56
A1
0.64 — —
A2
2.41 — 2.67
b
0.41 — 0.51
B
0.66 — 0.81
C
0.20 — 0.25
D
17.02 — 17.27
E
8.26 — 8.76
E1
7.49 — 7.75
E2
6.27 — 7.29
e
1.27 BSC
INCHES
Min. Typ. Max.
— — 0.140
0.025 — —
0.095 — 0.105
0.016 — 0.020
0.026 — 0.032
0.008 — 0.010
0.670 — 0.680
0.325 — 0.345
0.295 — 0.305
0.247 — 0.287
0.050 BSC
Notes:
1. Controlling dimension: inches, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
protrusions and should be measured from the bottom of
the package.
4. Formed leads shall be planar with respect to one
another within 0.004 inches at the seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
02/25/03