IS61LV6416 Datasheet, PDF (13/16 Pages) Integrated Circuit Solution Inc – 64K X 16 HIGH SPEED CMOS STATIC RAM WITH 3.3 V SUPPLY

PACKAGING INFORMATION
400-mil Plastic SOJ
Package Code: K
ISSI^®
N
1
D
e
N/2+1
E1
N/2
Notes:
1. Controlling dimension:
millimeters.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions
E
and should be measured from
the bottom of the package.
4. Reference document: JEDEC
MS-027.
SEATING PLANE
A
b
C
A2
B
A1
E2
Millimeters
Inches
Symbol Min Max Min Max
No. Leads (N)
28
A
3.25 3.75 0.128 0.148
A1
0.64 —
0.025 —
A2
2.08 —
0.082 —
B
0.38 0.51 0.015 0.020
b
0.66 0.81 0.026 0.032
C
0.18 0.33 0.007 0.013
D 18.29 18.54 0.720 0.730
E 11.05 11.30 0.435 0.445
E1 10.03 10.29 0.395 0.405
E2
9.40 BSC
0.370 BSC
e
1.27 BSC
0.050 BSC
Millimeters
Min Max
32
3.25 3.75
0.64 —
2.08 —
0.38 0.51
0.66 0.81
0.18 0.33
20.82 21.08
11.05 11.30
10.03 10.29
9.40 BSC
1.27 BSC
Inches
Min Max
0.128 0.148
0.025 —
0.082 —
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Millimeters
Inches
Min Max Min Max
36
3.25 3.75 0.128 0.148
0.64 —
0.025 —
2.08 —
0.082 —
0.38 0.51 0.015 0.020
0.66 0.81 0.026 0.032
0.18 0.33 0.007 0.013
23.37 23.62 0.920 0.930
11.05 11.30 0.435 0.445
10.03 10.29 0.395 0.405
9.40 BSC
0.370 BSC
1.27 BSC
0.050 BSC
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
10/29/03