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IS61WV51232ALL Datasheet, PDF (1/19 Pages) Integrated Silicon Solution, Inc – 512K x 32 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY
IS61WV51232ALL/ALS
IS61WV51232BLL/BLS
IS64WV51232BLL/BLS
512K x 32 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
PRELIMINARY INFORMATION
APRIL 2008
FEATURES
• High-speed access times:
8, 10, 20 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
• Easy memory expansion with CE and OE op-
tions
• CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single power supply
VDD 1.65V to 2.2V (IS61WV51232Axx)
speed = 20ns for VDD 1.65V to 2.2V
DESCRIPTION
The ISSI IS61WV51232Axx/Bxx and IS64WV51232Bxx
are high-speed, 16M-bit static RAMs organized as 512K
words by 32 bits. It is fabricated using ISSI's high-perform-
ance CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields high-perfor-
mance and low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory.
VDD 2.4V to 3.6V (IS61/64WV51232Bxx)
speed = 10ns for VDD 2.4V to 3.6V
The device is packaged in the JEDEC standard 90-ball BGA
(8mm x 13mm).
speed = 8ns for VDD 3.3V + 5%
• Packages available:
– 90-ball miniBGA (8mm x 13mm)
• Industrial and Automotive Temperature Support
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
A0-A18
VDD
VSS
DQa-d
DECODER
I/O
DATA
CIRCUIT
512K x 32
MEMORY ARRAY
COLUMN I/O
CE
OE
WE
BWa-d
CE2
CONTROL
CIRCUIT
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. 00B
04/23/08