IRF8306MPBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Integrated Monolithic Schottky Diode

IRF8306MPbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
T_P
Peak Soldering Temperature
T_J
Operating Junction and
T_STG
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
Max.
2.1
1.3
75
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.017
Max.
60
–––
–––
1.66
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
τJ
τJ
τ1
τ1
R1
R1
Ci= τi/Ri
Ci i/Ri
R2
R2
τ2
τ2
R3
R4
Ri (°C/W) τι (sec)
R3
R4
τC ^{24.84696 2.379018}
τ3 _τ3
τ4 ^{τ 10.92897 0.219018}
τ4 _{3.658783 0.00733}
20.42272 15.9657
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient ƒ
Notes:
ˆ Used double sided cooling , mounting pad with large heatsink.
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
‰ Mounted to a PCB with
small clip heatsink (still air)
‰ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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May 7, 2014