ISL5416_14 Datasheet, PDF (71/71 Pages) Intersil Corporation – Four-Channel Wideband Programmable

ISL5416
Plastic Ball Grid Array Packages (BGA)
o
A1
CORNER
A1
CORNER I.D.
A
D
E
B
TOP VIEW
0.15
0.006
M
C
A
B
0.08
0.003
M
C
D1
b
161514 1312 1110 9 8 7 6 5 4 3 2 1
S
A
A1
CORNER
A1
CORNER I.D.
A
B
C
D
E
F
G
H _E1
J
K
L
M
N
P
R
T
S
A
e
ALL ROWS AND COLUMNS
BOTTOM VIEW
A1
A2
C
A
bbb C
SIDE VIEW
aaa C
SEATING PLANE
V256.17x17
256 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.059
-
1.50
-
A1
0.012 0.016 0.31
0.41
-
A2
0.037 0.044 0.95
1.13
-
b
0.016 0.020 0.41
0.51
7
D/E
0.665 0.673 16.90 17.10
-
D1/E1 0.587 0.595 14.90 15.10
-
N
256
256
-
e
0.039 BSC
1.0 BSC
-
MD/ME
16 x 16
16 x 16
-
bbb
0.004
0.10
3
ααα
0.005
0.12
-
NOTES:
Rev. 2 01/03
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to AMSE Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D” and
“E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body thick-
ness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter, paral-
lel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines the
position of the solder balls nearest to package centerlines. When
there is an even number of balls in the outer row the value is
“S” = e/2.
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