ISL5216_05 Datasheet, PDF (65/65 Pages) Intersil Corporation – Four-Channel Programmable Digital DownConverter

ISL5216
Plastic Ball Grid Array Packages (BGA)
o
A1 CORNER
A
D
A1 CORNER I.D.
E
B
TOP VIEW
0.15
0.006
MC
A
B
0.08
0.003
M
C
D1
A1
CORNER
b
S
A
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A1
CORNER I.D.
A
B
C
D
E
F
G
H
E1
J
K
L
M
N
P
S
A
e
ALL ROWS AND COLUMNS
BOTTOM VIEW
A1
A2
C
A
bbb C
aaa C
SEATING PLANE
SIDE VIEW
V196.15x15
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.059
-
1.50
-
A1
0.012 0.016 0.31
0.41
-
A2
0.037 0.044 0.93
1.11
-
b
0.016 0.020 0.41
0.51
7
D/E
0.587 0.595 14.90 15.10
-
D1/E1 0.508 0.516 12.90 13.10
-
N
196
196
-
e
0.039 BSC
1.0 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
NOTES:
Rev. 1 12/00
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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65
July 8, 2005