ISL6568_06 Datasheet, PDF (26/29 Pages) Intersil Corporation – Two-Phase Buck PWM Controller with Integrated MOSFET Drivers for VRM9, VRM10, and AMD Hammer Applications

ISL6568
the total number of input capacitors required to support the
RMS current calculated. The voltage rating of the capacitors
should also be at least 1.25 times greater than the maximum
input voltage. Figure 23 provides the same input RMS
current information for single-phase designs. Use the same
approach for selecting the bulk capacitor type and number.
0.6
0.4
0.2
I_L,PP = 0
I_L,PP = 0.5 I_O
I_L,PP = 0.75 I_O
0
0
0.2
0.4
0.6
0.8
1.0
DUTY CYCLE (V_IN/V_O)
FIGURE 23. NORMALIZED INPUT-CAPACITOR RMS
CURRENT FOR SINGLE-PHASE CONVERTER
Low capacitance, high-frequency ceramic capacitors are
needed in addition to the input bulk capacitors to suppress
leading and falling edge voltage spikes. The spikes result from
the high current slew rate produced by the upper MOSFET
turn on and off. Select low ESL ceramic capacitors and place
one as close as possible to each upper MOSFET drain to
minimize board parasitics and maximize suppression.
Layout Considerations
MOSFETs switch very fast and efficiently. The speed with
which the current transitions from one device to another
causes voltage spikes across the interconnecting
impedances and parasitic circuit elements. These voltage
spikes can degrade efficiency, radiate noise into the circuit
and lead to device overvoltage stress. Careful component
selection, layout, and placement minimizes these voltage
spikes. Consider, as an example, the turnoff transition of the
upper PWM MOSFET. Prior to turnoff, the upper MOSFET
was carrying channel current. During the turnoff, current
stops flowing in the upper MOSFET and is picked up by the
lower MOSFET. Any inductance in the switched current path
generates a large voltage spike during the switching interval.
Careful component selection, tight layout of the critical
components, and short, wide circuit traces minimize the
magnitude of voltage spikes.
There are two sets of critical components in a DC-DC
converter using a ISL6566 controller. The power
components are the most critical because they switch large
amounts of energy. Next are small signal components that
connect to sensitive nodes or supply critical bypassing
current and signal coupling.
The power components should be placed first, which include
the MOSFETs, input and output capacitors, and the inductors. It
is important to have a symmetrical layout for each power train,
preferably with the controller located equidistant from each.
Symmetrical layout allows heat to be dissipated equally
across all three power trains. Equidistant placement of the
controller to the three power trains also helps keep the gate
drive traces equally short, resulting in equal trace impedances
and similar drive capability of all sets of MOSFETs.
When placing the MOSFETs try to keep the source of the
upper FETs and the drain of the lower FETs as close as
thermally possible. Input Bulk capacitors should be placed
close to the drain of the upper FETs and the source of the lower
FETs. Locate the output inductors and output capacitors
between the MOSFETs and the load. The high-frequency input
and output decoupling capacitors (ceramic) should be placed
as close as practicable to the decoupling target, making use of
the shortest connection paths to any internal planes, such as
vias to GND next or on the capacitor solder pad.
The critical small components include the bypass capacitors
for VCC and PVCC, and many of the components
surrounding the controller including the feedback network
and current sense components. Locate the VCC/PVCC
bypass capacitors as close to the ISL6566 as possible. It is
especially important to locate the components associated
with the feedback circuit close to their respective controller
pins, since they belong to a high-impedance circuit loop,
sensitive to EMI pick-up. It is also important to place the
current sense components close to their respective pins on
the ISL6566, including R_ISEN, R_S, R_COMP, and C_COMP.
A multi-layer printed circuit board is recommended. Figure 25
shows the connections of the critical components for the
converter. Note that capacitors C_xxIN and C_xxOUT could each
represent numerous physical capacitors. Dedicate one solid
layer, usually the one underneath the component side of the
board, for a ground plane and make all critical component
ground connections with vias to this layer. Dedicate another
solid layer as a power plane and break this plane into smaller
islands of common voltage levels. Keep the metal runs from the
PHASE terminal to output inductors short. The power plane
should support the input power and output power nodes. Use
copper filled polygons on the top and bottom circuit layers for
the phase nodes. Use the remaining printed circuit layers for
small signal wiring.
Routing UGATE, LGATE, and PHASE traces
Great attention should be paid to routing the UGATE, LGATE,
and PHASE traces since they drive the power train MOSFETs
using short, high current pulses. It is important to size them as
large and as short as possible to reduce their overall
impedance and inductance. They should be sized to carry at
least one ampere of current (0.02” to 0.05”). Going between
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FN9187.4
March 9, 2006