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HFA3842B Datasheet, PDF (26/26 Pages) Intersil Corporation – PCMCIA/USB Wireless LAN Medium Access Controller
HFA3842B
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
-D-
-A-
-B-
E E1
PIN 1
-H-
GAGE
PLANE
0.020
0.008 MIN
0o MIN
L
0o-7o
0.25
0.010
e
SEATING
A PLANE
0.08
0.003
-C-
11o-13o
0.13
0.005
M
C
A-B S
DS
b
b1
0.09/0.16
A2 A1 0.004/0.006
11o-13o
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
Q128.14x20 (JEDEC MS-026BHB ISSUE C)
128 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYM-
BOL
INCHES
MIN
MAX
MILLIMETERS
MIN
MAX
NOTES
A
-
0.062
-
1.60
-
A1
0.002 0.005 0.05
0.15
-
A2
0.054 0.057 1.35
1.45
-
b
0.007 0.010 0.17
0.27
6
b1
0.007 0.009 0.17
0.23
-
D
0.862 0.870 21.90 22.10
3
D1
0.783 0.791 19.90 20.10
4, 5
E
0.626 0.634 15.90 16.10
3
E1
0.547 0.555 13.90 14.10
4, 5
L
0.018 0.029 0.45
0.75
-
N
128
128
7
e
0.0197 BSC
0.50 BSC
-
NOTES:
Rev. 0 7/99
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003 inch).
7. “N” is the number of terminal positions.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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