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ISL70517SEH Datasheet, PDF (24/27 Pages) Intersil Corporation – Precision test and measurement
ISL70517SEH
Package Characteristics
Weight of Packaged Device
1.33 grams (Typical)
Lid Characteristics
Finish: Gold
Potential: Connected to Pin #8 (GND)
Case Isolation to Any Lead: 20 x 109 Ω (min)
Die Characteristics
Die Dimensions
2960µm x 3210µm (117 mils x 127 mils)
Thickness: 483µm ± 25µm (19 mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Silicon Nitride
Thickness: 15kÅ
Metalization Mask Layout
TOP METALLIZATION
Type: AlCu (99.5%/0.5%)
Thickness: 30kÅ
BACKSIDE FINISH
Silicon
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
<2 x 105 A/cm2
PROCESS
Dielectrically Isolated Advanced Bipolar Technology- PR40
DNC DNC
IN+
IN-
+RFB
+RFB SENSE
-RFB SENSE
-RFB
GND
VCC
DNC
+RIN
+RIN SENSE
-RIN SENSE
-RIN
NC
VEE
VCO
+VFB +VOUT
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VEO
NC
-VREF
FN8699.4
December 15, 2016