ISL5217 Datasheet, PDF (21/43 Pages) Intersil Corporation – Quad Programmable Up Converter

ISL5217
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.8V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to V_CC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range Core, V_CCC . . . . . . . . . . . . . . . . . . . . +2.4V to +2.6V
Voltage Range I/O, V_CCCIO (Note 2) . . . . . . . . . . . +3.15V to +3.45V
Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40^oC to 85^oC
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V_CC
Thermal Information
Thermal Resistance (Typical, Notes 1, 3)
θ_JA (^oC/W)
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . .
33
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
29
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
27
Maximum Package Power Dissipation at 85^oC
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . .1.97W
Maximum Storage Temperature Range . . . . . . . . . . -65^oC to 150^oC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150^oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300^oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. Single supply operation of both the core VCCC and I/O VCCIO at 2.5V is allowed. Degradation of the I/O timing should be expected.
3. Tie 196CABGA package rows F, G, H, and J pins 6-9 to heat sink or ground to ensure maximum device heat dissipation.
DC Electrical Specifications V_CCC = 2.5 ± 5%, V_CCIO = 3.3 ±5%, T_A = -40^oC to 85^oC
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
Logical One Input Voltage
V_IH
V_CCC = 2.6V, V_CCIO = 3.45V
2.0
-
V
Logical Zero Input Voltage
V_IL
V_CCC = 2.4V, V_CCIO = 3.15V
-
0.8
V
Clock Input High
V_IHC V_CCC = 2.6V, V_CCIO = 3.45V
2.0
-
V
Clock Input Low
V_IHL
V_CCC = 2.4V, V_CCIO = 3.15V
-
0.8
V
Output High Voltage
V_OH
I_OH = -2mA, V_CCC = 2.4V, V_CCIO = 3.15V
2.6
-
V
Output Low Voltage
V_OL
I_OL = 2mA, V_CCC = 2.4V, V_CCIO = 3.15V
0.4
V
Input Leakage Current
I_L
V_IN = V_CCIO or GND, V_CCC = 2.6V, V_CCIO = 3.45V
-10
10
µA
Output Leakage Current
I_H
V_IN = V_CCIO or GND, V_CCC = 2.6V, V_CCIO = 3.45V
-10
10
µA
Input Pull-up Leakage Current Low
I_SL
V_IN = V_CCIO or GND, V_CCC = 2.6V, V_CCIO = 3.45V,
-500
-
µA
TMS, TRST, TDI
Input Pull-up Leakage Current High
I_SH
V_IN = V_CCIO or GND, V_CCC = 2.6V, V_CCIO = 3.45V,
TMS, TRST, TDI
-
10
µA
Standby Power Supply Current
Operating Power Supply Current
Input Capacitance
I_CCSB
I_CCOP
C_IN
V_CCC = 2.6V, V_CCIO = 3.45V, Outputs Not Loaded
f = 80MHz, V_IN = V_CCIO or GND,
V_CCIO = 3.45V, V_CCC = 2.6V
Freq = 1MHz, V_CCIO Open, All Measurements Are
Referenced to Device Ground
-
5
mA
-
540 mA (Note 4)
-
7 pF (Note 5)
Output Capacitance
C_OUT
Freq = 1MHz, V_CCIO Open, All Measurements are
Referenced to Device Ground
-
7 pF (Note 5)
NOTES:
4. Power Supply current is proportional to operation frequency. Typical rating for I_CCOP is 7mA/MHz.
5. Capacitance T_A = 25^oC, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
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