80960KA Datasheet, PDF (33/43 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960KA
Table 14. 80960KA PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50
100
200
400
600
(0) (0.25) (0.50) (1.01) (2.03) (3.04)
θ Junction-to-Case
9
9
9
9
9
9
θ Case-to-Ambient
(No Heatsink)
22
19
18
NOTES:
1. This table applies to 80960KA PQFP soldered
directly to board.
2. θ_JA = θ_JC + θ_CA
16
11
9
3. θ_JL = 18°C/W (approx.)
θ_JB = 18°C/W (approx.)
800
(4.06)
9
8
θ_JC
θ_JL
θ_JB
CLK2
CLK
HOLD
HLDA
T_h
T_h
T_h
T₁₂
T_6H
T₁₁
T_9H
Figure 22. HOLD Timing
30