80960KA Datasheet, PDF (2/43 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960KA
EMBEDDED 32-BIT MICROPROCESSOR
1.0 THE i960® PROCESSOR ................................ 1
1.1. Key Performance Features .......................... 2
1.1.1. Memory Space And Addressing Modes . 4
1.1.2. Data Types ............................................. 4
1.1.3. Large Register Set ................................. 4
1.1.4. Multiple Register Sets ............................ 5
1.1.5. Instruction Cache ................................... 5
1.1.6. Register Scoreboarding ......................... 5
1.1.7. High Bandwidth Local Bus ..................... 6
1.1.8. Interrupt Handling ................................... 6
1.1.9. Debug Features ..................................... 6
1.1.10. Fault Detection ..................................... 7
1.1.11. Built-in Testability ................................. 7
1.1.12. CHMOS ................................................ 7
2.0 ELECTRICAL SPECIFICATIONS .................. 10
2.1. Power and Grounding ................................ 10
2.2. Power Decoupling Recommendations ....... 10
2.3. Connection Recommendations .................. 11
2.4. Characteristic Curves ................................. 11
2.5. Test Load Circuit ........................................ 14
2.6. Absolute Maximum Ratings ....................... 15
2.7. DC Characteristics ..................................... 15
2.8. AC Specifications ....................................... 16
2.8.1. AC Specification Tables ....................... 17
3.0 MECHANICAL DATA ..................................... 21
3.1. Packaging .................................................. 21
3.1.1. Pin Assignment .................................... 21
3.2. Pinout ......................................................... 25
3.3. Package Thermal Specification ................. 29
4.0. WAVEFORMS ............................................... 33
5.0. REVISION HISTORY ..................................... 38
FIGURES
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The 80960KA Processor’s Highly
Parallel Architecture ............................ i
80960KA Programming
Environment ........................................ 1
Instruction Formats ............................. 4
Multiple Register Sets Are Stored
On-Chip ............................................... 6
Connection Recommendations
for Low Current Drive Network .......... 11
Connection Recommendations
for High Current Drive Network ......... 11
Typical Supply Current vs.
Case Temperature ............................ 12
Typical Current vs. Frequency
(Room Temp) .................................... 12
Typical Current vs. Frequency
(Hot Temp) ........................................ 13
Worst-Case Voltage vs. Output
Current on Open-Drain Pins .............. 13
Capacitive Derating Curve ................ 13
Test Load Circuit for Three-State
Output Pins ...................................... 14
Test Load Circuit for Open-Drain
Output Pins ...................................... 14
Drive Levels and Timing Relationships
for 80960KA Signals ......................... 16
Processor Clock Pulse (CLK2) .......... 20
RESET Signal Timing ....................... 20
32-Lead Pin-Grid Array
(PGA) Package ................................. 21
80960KA PGA Pinout—View from
Bottom (Pins Facing Up) ................... 22
80960KA PGA Pinout—View from
Top (Pins Facing Down) .................... 23
80960KA 132-Lead Plastic Quad
Flat-Pack (PQFP) Package ............... 23
PQFP Pinout - View From Top .......... 24
HOLD Timing .................................... 30
16 MHz Maximum Allowable
Ambient Temperature ....................... 31
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