80960KA Datasheet, PDF (24/43 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960KA
3.0 MECHANICAL DATA
3.1. Packaging
The 80960KA is available in two package types:
• 132-lead ceramic pin-grid array (PGA). Pins are
arranged 0.100 inch (2.54 mm) center-to-center, in
a 14 by 14 matrix, three rows around (see Figure
17).
• 132-lead plastic quad flat pack (PQFP). This
package uses fine-pitch gull wing leads arranged in
a single row along the package perimeter with
0.025 inch (0.64 mm) spacing (see Figure 20).
Dimensions for both package types are given in the
Intel Packaging handbook (Order #240800).
3.1.1. Pin Assignment
The PGA and PQFP have different pin assignments.
Figure 18 shows the view from the PGA bottom (pins
facing up) and Figure 19 shows a view from the PGA
top (pins facing down). Figure 20 shows the PQFP
package; Figure 21 shows the PQFP pinout with
signal names. Notice that the pins are numbered in
order from 1 to 132 around the package perimeter.
Table 9 and Table 10 list the function of each PGA
pin; Table 11 and Table 12 list the function of each
PQFP pin.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A B C D E F G H J K LM N P
Figure 17. 132-Lead Pin-Grid Array (PGA) Package
21