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HYS64D32020GDL Datasheet, PDF (7/31 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules | |||
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HYS64D[1600x/32020]GDLâ[5/6/7/8]âB
Small Outline DDR SDRAM Modules
Overview
Table 2 Ordering Information
Type
Compliance Code
PC3200 (CL=3)
HYS64D32020GDL-5-B PC3200Sâ3033â0âA1
Description
SDRAM Technology
two ranks 256 MB SO-DIMM 256 Mbit (Ã 16)
PC2700 (CL=2.5)
HYS64D16000GDLâ6âB
HYS64D16001GDLâ6âB
HYS64D32020GDLâ6âB
PC2700Sâ2533â0âC1
PC2700Sâ2533â0âC1
PC2700Sâ2533â0âA1
one rank 128 MB SO-DIMM
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
256 MBit (Ã 16)
256 MBit (Ã 16)
256 MBit (Ã 16)
PC2100 (CL=2)
HYS64D16000GDLâ7âB
HYS64D16001GDLâ7âB
HYS64D32020GDLâ7âB
PC2100Sâ2033â0âC1
PC2100Sâ2033â0âC1
PC2100Sâ2033â0âA1
one rank 128 MB SO-DIMM
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
256 MBit (Ã 16)
256 MBit (Ã 16)
256 MBit (Ã 16)
PC1600 (CL=2)
HYS64D16000GDLâ8âB
HYS64D32020GDLâ8âB
PC1600Sâ2022â0âC1
PC1600Sâ2022â0âA1
one rank 128 MB SO-DIMM 256 MBit (Ã 16)
two ranks 256 MB SO-DIMM 256 MBit (Ã 16)
Notes
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components.
2. The Compliance Code is printed on the module labels describing the speed sort (for example âPC2700â), the
latencies and SPD code definition (for example â2033â0â means CAS latency of 2.0 clocks, RCD1) latency of
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
1) RCD: Row-Column-Delay
Data Sheet
7
V1.2, 2003-08
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