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HYS64D32020GDL Datasheet, PDF (19/31 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules
HYS64D[1600x/32020]GDL–[5/6/7/8]–B
Small Outline DDR SDRAM Modules
AC Characteristics
Table 11 AC Timing - Absolute Specifications –6/–5 (cont’d)
Parameter
Symbol
–6
DDR333
Min. Max.
Address and control input setup time tIS
0.75 —
–5
DDR400B
Min. Max.
0.6 —
Unit
ns
Note/ Test
Condition 1)
fast slew rate
3)4)5)6)10)
0.8 —
0.7 —
ns
slow slew
rate
3)4)5)6)10)
Address and control input hold time tIH
0.75 —
0.6 —
ns
fast slew rate
3)4)5)6)10)
0.8 —
0.7 —
ns
slow slew
rate
3)4)5)6)10)
Read preamble
tRPRE
Read postamble
tRPST
Active to Precharge command
tRAS
Active to Active/Auto-refresh command tRC
period
Auto-refresh to Active/Auto-refresh
command period
tRFC
Active to Read or Write delay
Precharge command period
Active to Autoprecharge delay
Active bank A to Active bank B
command
tRCD
tRP
tRAP
tRRD
Write recovery time
tWR
Auto precharge write recovery +
tDAL
precharge time
Internal write to read command delay tWTR
Exit self-refresh to non-read command tXSNR
Exit self-refresh to read command
tXSRD
Average Periodic Refresh Interval
tREFI
0.9
0.40
42
60
1.1
0.9
0.60 0.40
70E+3 40
—
55
1.1
tCK
0.60
tCK
70E+3 ns
—
ns
72
—
65
—
ns
18
—
15
—
ns
18
—
15
—
ns
18
—
15
—
ns
12
—
10
—
ns
15
—
15
—
ns
tCK
1
—
1
—
tCK
75
—
75
—
ns
200 —
200 —
tCK
—
7.8
—
7.8
µs
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)11)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)12)
1) 0 ° C ≤TA ≤70 ° C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V
(DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) These parameters guarantee device timing, but they are not necessarily tested on each device.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
Data Sheet
19
V1.2, 2003-08