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HYS64D32020GDL Datasheet, PDF (6/31 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules
200-Pin Small Outline Dual-In-Line Memory Modules
SO-DIMM
HYS64D32020GDL–[5/6/7/8]–B
HYS64D1600xGDL–[6/7/8]–B
1
Overview
1.1
Features
• Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
• One rank 16M × 64 and two bank 32M × 64 organization
• JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
• Single +2.5 V (± 0.2 V) power supply
• Built with 256 Mbit DDR SDRAMs organised as × 16 in P–TSOPII–66–1 packages
• Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• All inputs and outputs SSTL_2 compatible
• Serial Presence Detect with E2PROM
• Jedec standard form factor: 67.60 mm × 31.75 mm × 3.00 / 3.80 mm
• Jedec standard reference layout Raw Cards A and C
• DDR400 speed grade supported
• Gold plated contacts
Table 1 Performance
Part Number Speed Code
–5
–6
–7
–8
Unit
Speed Grade
Component DDR400B DDR333B DDR266A DDR200
—
Module
PC3200–3033 PC2700–2533 PC2100–2033 PC1600–2022 —
max. Clock Frequency @CL3 fCK3 200
166
—
—
MHz
@CL2.5 fCK2.5 166
166
143
125
MHz
@CL2 fCK2 133
133
133
100
MHz
1.2
Description
The HYS64D32020GDL–[5/6/7/8]–B and HYS64D1600xGDL–[6/7/8]–B are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M × 64 and 16M × 64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E2PROM device using the
2-pin I2C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
available to the customer.
Data Sheet
6
V1.2, 2003-08