TLE5012_10 Datasheet, PDF (61/64 Pages) Infineon Technologies AG – GMR-Based Angular Sensor for Rotor-Position Sensing

4
Package Information
4.1
Package Parameters
Table 29 Package parameters
Parameter
Symbol Limit Values
Unit
min. typ. max.
Thermal resistance
R_thJA
-
R_thJC
-
R_thJL
-
Soldering moisture level
150 200 K/W
- 75 K/W
- 85 K/W
MSL 3
Lead frame
Cu
Plating
1) According to Jedec JESD51-7
Sn 100%
4.2
Package Outline
TLE5012
Package Information
Notes
Junction to air¹⁾
Junction to case
Junction to lead
260°C
> 7 µm
Figure 32 PG-DSO-8 package dimensions
Final Data Sheet
61
V 1.0, 2010-11