TLE5012_10 Datasheet, PDF (20/64 Pages) Infineon Technologies AG – GMR-Based Angular Sensor for Rotor-Position Sensing

TLE5012
Specifications
Calculation of the Junction Temperature
The total power dissipation P_TOT of the chip increases its temperature above the ambient temperature.
The power multiplied by the total thermal resistance R_thJA (Junction to Ambient) leads to the final junction
temperature. R_thJA is the sum of the addition of the values of the two components Junction to Case and Case to
Ambient.
R_thJA = R_thJC + R_thCA
(1)
T_J = T_A + ΔT
ΔT = R_thJA × P_TOT = R_thJA × (V_DD × I _DD + V_OUT × I_OUT ) (I_DD, I_OUT > 0, if direction is into IC)
Example (assuming no load on V_out):
V_DD = 5V
(2)
I _DD = 14 mA
ΔT
=
150
⎡^K
⎢⎣_W
⎤
⎥⎦
×
(5[V ]×
0.014 [A] +
0[VA ]) = 10.5K
For molded sensors, the calculation with R_thJC is more appropriate.
3.4
Characteristics
3.4.1 Electrical Parameters
The indicated electrical parameters apply to the full operating range, unless otherwise specified. The typical values
correspond to a supply voltage V_DD = 5.0 V and 25 °C, unless individually specified. All other values correspond
to -40 °C < T_J < 150°C.
Table 4 Electrical parameters
Parameter
Symbol
Values
Min. Typ. Max.
Supply current
POR level
POR hysteresis¹⁾
Pull-Up current
I_DD
-
14 16
V_POR
2.0
-
2.9
V_PORhy -
30 -
I_PU
-10 -
-225
-10 -
-150
Pull-Down current
I_PD
10
-
225
10
-
150
Power-on time
t_Pon
-
5
7
1) Not subject to production test - verified by design/characterization
2) Within “Power-On Time,” write access is not permitted
Unit Note / Test Condition
mA
V
Power-On Reset
mV
µA CSQ
µA DATA
µA SCK
µA CLK, IFA, IFB
ms
V_DD > V_DDmin2)
Final Data Sheet
20
V 1.0, 2010-11