BTM7755G Datasheet, PDF (22/24 Pages) Infineon Technologies AG – High Current H-Bridge Trilith IC 3G

8
Package Outlines
High Current H-Bridge
BTM7755G
Package Outlines
0.35 x 45˚
7.6 _-0.2 ¹⁾
0.65
C
17 x 0.65 = 11.05
0.1 C 36x
SEATING PLANE
0.33 ^{±0.08 2)}
A
36
19
0.17 M C A-B D 36x
Ejector Mark
Depth 0.2 MAX.
0.7 ±0.2
10.3 ±0.3
D
1
18
B
12.8 _-0.2 ¹⁾
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
PG-DSO-36-20, -29, -34, -43, -44-PO V05
Footprint
1.67
9.73
HLGF1145
Figure 14 PG-DSO-36-29 (Plastic Green Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
22
Dimensions in mm
Rev. 2.0, 2010-05-28