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HYS64D16000GU-7-A Datasheet, PDF (21/30 Pages) Infineon Technologies AG – Unbuffered DDR SDRAM-Modules
HYS[64/72]D[16000/32020]GU-[7/8]-A
Unbuffered DDR SDRAM-Modules
Electrical Characteristics
Table 10 AC Timing - Absolute Specifications –8/–7
Parameter
Symbol
–8
DDR200
Min. Max.
Address and control input hold time
tIH
1.1 —
–7
DDR266A
Min. Max.
0.9
—
Unit Note/
Test Condition 1)
ns fast slew rate
3)4)5)6)10)
1.1 —
1.0
—
ns slow slew rate
3)4)5)6)10)
Read preamble
Read preamble setup time
Read postamble
Active to Precharge command
Active to Active/Auto-refresh command
period
tRPRE
tRPRE1.5
tRPRES
tRPST
tRAS
tRC
0.9
0.9
1.5
0.40
50
70
1.1
1.1
—
0.60
120E+3
—
0.9
NA
NA
0.40
45
65
1.1
tCK
tCK
ns
0.60
tCK
120E+3 ns
—
ns
Auto-refresh to Active/Auto-refresh
command period
tRFC
80 —
75
—
ns
Active to Read or Write delay
Precharge command period
Active to Autoprecharge delay
Active bank A to Active bank B
command
tRCD
tRP
tRAP
tRRD
20 —
20 —
20 —
15 —
20
—
ns
20
—
ns
20
—
ns
15
—
ns
Write recovery time
Auto precharge write recovery +
precharge time
tWR
15 —
15
—
ns
tDAL
(twr/tCK) + (trp/tCK)
tCK
Internal write to read command delay tWTR
1
—
tWTR1.5 2
—
Exit self-refresh to non-read command tXSNR 80 —
Exit self-refresh to read command
tXSRD
200 —
Average Periodic Refresh Interval
tREFI
— 7.8
1
—
tCK
—
—
tCK
75
—
ns
200
—
tCK
—
7.8
µs
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V
2) Input slew rate ≥ 1 V/ns for DDR266, and = 1 V/ns for DDR200
CL > 1.5 2)3)4)5)
CL = 1.5 2)3)4)5)11)
2)3)4)5)12)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)13)
CL > 1.5 2)3)4)5)
CL = 1.5 2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)14)
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) These parameters guarantee device timing, but they are not necessarily tested on each device.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
Data Sheet
21
Rev. 1.02, 2003-11