1EDS20I12SV Datasheet, PDF (20/33 Pages) Infineon Technologies AG – Single-channel isolated IGBT Driver

EiceDRIVER™ Safe
1EDS - slew rate control IGBT driver IC
5
Electrical parameters
5.1
Absolute maximum ratings
Note: Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of
the integrated circuit. Unless otherwise noted all parameters refer to GND1 and to T_A =25°C.
Table 4
Abs. maximum ratings
Parameter
Symbol Min.
Max.
Unit
Positive power supply input side
V_VCC1
-0.3
PADP voltage
V_PADP
-0.3
PADN voltage
V_PADN
-0.3
Voltage at terminals INN, INP, EN, RDY1, RDY2, /FLT, EN
Voltage at terminals SIGI, SIGO, SPEED
V_TERMINAL -0.3
-0.3
Voltage at terminals DESAT¹⁾
-5
Voltage at terminals GATE ²⁾,
-0.3
Voltage at terminals OCOFF¹⁾, RSENSE ²⁾, OFF ²⁾, SOFF ²⁾
-0.3
Voltage at terminals CS ¹⁾, VZ ²⁾, CZ ²⁾, PRB ²⁾
-0.3
Positive power supply output side ¹⁾
Negative power supply output side ¹⁾
V_VCC2
V_VEE2
-0.3
-12
Maximum power supply voltage output side (V_VCC2 - V_VEE2)
V_max2
–
Open drain output current (/FLT, RDY2, RDY1)
I_OD
–
Output current at terminals SIGO
I_SIGO
-6
Peak output current at terminal ON (t_p = 2 µs, f = 20 kHz)
I_ON,pk
–
DC output current at terminal ON (V_CC2 = 20 V)
I_ON,DC
–
Peak output current at terminal OFF (t_p = 2 µs, , f = 20 kHz)
I_OFF
–
Peak output current at terminal SOFF (t_p = 2 µs, , f = 20 kHz) ISOFF
–
Junction temperature
T_J
-40
Storage temperature
Total power dissipation ³⁾
T_S
-55
P_D,tot
–
Thermal resistance (Both chips active), T_A = 25 °C
ESD Capability
R_th(j-a)
–
HBM ⁴⁾ VESD
–
CDM ⁵⁾
6.5
16.05
0.3
V_PADP
V_VCC1
V_VCC2
V_VCC2
V_VCC2
5.5
20.3
0.3
28
10
6
50
10
2.4
1.05
125
125
980
102
tbd
tbd
V
mA
A
°C
mW
K/W
kV
Common mode transient immunity
|dV_ISO/dt| 50
–
kV/µs
1) _{with respect to terminal GND2}
2) _{with respect to terminal VEE2}
3) _{Power dissipation is derated linearly with 9.8 mW/°C above an ambient temperature of TA = 25°C. See Figure}
18 for reference layouts for these thermal data. Thermal performance may change significantly with layout and
heat dissipation of components in close proximity.
4) _{According to EIA/JESD22-A114-B}
5) _{According to EIA/JESD22-C101}
Target datasheet
20
<Revision 0.73>, 05.06.2014