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PTFA261301E Datasheet, PDF (2/12 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs 130 W, 2.62-2.68 GHz
PTFA261301E
PTFA261301F
RF Performance (cont.)
Two-tone Measurements (tested in Infineon test fixture)
VDD = 28 V, IDQ = 1.4 A, POUT = 130 W PEP, ƒ = 2680 MHz, tone spacing = 1 MHz
Characteristic
Symbol Min
Gain
Gps
12.5
Drain Efficiency
ηD
34.5
Intermodulation Distortion
IMD
—
Typ
13.5
36
–28.5
Max
—
—
–27
Unit
dB
%
dBc
DC Characteristics
Characteristic
Drain-Source Breakdown Voltage
Drain Leakage Current
On-State Resistance
Operating Gate Voltage
Gate Leakage Current
Conditions
VGS = 0 V, IDS = 10 mA
VDS = 28 V, VGS = 0 V
VDS = 63 V, VGS = 0 V
VGS = 10 V, VDS = 0.1 V
VDS = 28 V, IDQ = 1.4 A
VGS = 10 V, VDS = 0 V
Maximum Ratings
Symbol
V(BR)DSS
IDSS
IDSS
RDS(on)
VGS
IGSS
Min
65
—
—
—
2.0
—
Typ
—
—
—
0.07
2.4
—
Max
—
1.0
10.0
—
3.0
1.0
Unit
V
µA
µA
Ω
V
µA
Parameter
Drain-Source Voltage
Gate-Source Voltage
Junction Temperature
Total Device Dissipation
Above 25°C derate by
Storage Temperature Range
Thermal Resistance (TCASE = 70°C, 130 W CW)
Ordering Information
Symbol
VDSS
VGS
TJ
PD
TSTG
RθJC
Value
65
–0.5 to +12
200
449
2.56
–40 to +150
0.39
Unit
V
V
°C
W
W/°C
°C
°C/W
Type
PTFA261301E
PTFA261301F
Package Outline
H-30260-2
H-31260-2
Package Description
Thermally-enhanced slotted flange, single-ended
Thermally-enhanced earless flange, single-ended
Marking
PTFA261301E
PTFA261301F
*See Infineon distributor for future availability.
Data Sheet
2 of 12
Rev. 07, 2007-04-04