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PTFB183408SV Datasheet, PDF (14/15 Pages) Infineon Technologies AG – High Power RF LDMOS Field Effect Transistor | |||
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PTFB183408SV
Package Outline Specifications
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Package H-37275G-6/2 with Formed Leads
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Diagram Notesâunless otherwise speciï¬ed:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [.005] unless speciï¬ed otherwise.
4. D1, D2 â drains; G1, G2 â gates; S â source; V1, V2 â VDD.
5. Lead thickness: 0.10 + 0.076/â0.025 mm [0.004+0.003/â0.001 inch].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].
Find the latest and most complete information about products and packaging at the Inï¬neon Internet page
http://www.inï¬neon.com/rfpower
Data Sheet
14 of 15
Rev. 03, 2014-03-07
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