XC228X_08 Datasheet, PDF (122/125 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2287 / XC2286 / XC2285
XC2000 Family Derivatives
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XC228x into the target system.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 36 Package Parameters (PG-LQFP-144-4)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
6.5 × 6.5 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
P_DISS
–
R_ΘJA
–
1.0
W–
45
K/W No thermal via¹⁾
36
K/W 4-layer, no pad²⁾
22
K/W 4-layer, pad³⁾
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Data Sheet
120
V2.1, 2008-08