BFQ790 Datasheet, PDF (11/30 Pages) Infineon Technologies AG – High Linearity High Gain 1/2 Watt RF Driver Amplifier

5
Thermal Characteristics
BFQ790
Thermal Characteristics
Table 5-1 Thermal Resistance
Parameter
Symbol
Junction - soldering point R_THJS
Min.
–
Values
Typ.
35
Max.
–
Unit Note / Test Condition
K/W –
1600
1400
1200
1000
800
600
400
200
0
0
20 40 60 80 100 120 140 160
T_S [°C]
Figure 5-1 Absolute Maximum Power Dissipation P_diss,max vs. T_s
Note: In the horizontal part of the derating curve the maximum power dissipation is given by P_diss,max=V_CE,max*I_C,max.
In this part the junction temperature T_J is lower than T_J,max. In the declining slope it is T_J=T_J,max, P_diss,max has
to be reduced according to the curve in order not to exceed T_J,max. It is T_J,max=T_S+P_diss,max*R_THJS.
Preliminary Data Sheet
11
Revision 2.0, 2014-08-26