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BFQ790 Datasheet, PDF (10/30 Pages) Infineon Technologies AG – High Linearity High Gain 1/2 Watt RF Driver Amplifier
BFQ790
Recommended Operating Conditions
4
Recommended Operating Conditions
This following table shows examples of recommended operating conditions. As long as maximum ratings are
regarded operation outside these conditions is permitted, but increases failure rate and reduces lifetime. For
further information refer to the quality report available on the BFQ790 internet page.
Table 4-1 Recommended Operating Conditions
Operating
Mode
Ambient Collector DC
RF Output Efficiency Dissipated Thermal Junction
Tempera- Current Power2) Power 3) 4)
Power5) Resistance Tempera-
ture1)
of pcb6)
ture7)
TA
IC
PDC
PRFout
η
[°C]
[mA]
[mW] [mW] (dBm) [%]
Pdiss
RTHSA
TJ
[mW]
[K/W]
[°C]
Compression 55
250
1250 500 (27) 40
750
35
110
Final stage 55
200
1000 250 (24) 25
750
35
110
High TA
85
120
600
50 (17)
8.5
550
10
110
Maximum TA 105
50
250
100 (20) 40
150
10
110
Linear
55
150
750
50 (17)
7
700
35
110
Very Linear 55
250
1250 50 (17)
4
1200
10
110
1) Is the operating case temperature respectively of the heat sink.
2) PDC = VCE * IC with VCE = 5V.
3) RF power delivered to the load, PRFout = η * PDC.
4) Efficiency of the conversion from DC power to RF power, η = PRFout / PDC (collector efficiency).
5) Pdiss = PDC - PRFout. The RF output power PRFout delivered to the load reduces the power Pdiss to be dissipated by the
device. This means a good output match is recommended.
6) RTHSA is the thermal resistance of the pcb including heat sink, that is between the soldering point S and the ambient A.
Regard the impact of RTHSA on the junction temperature TJ, see below. The thermal design of the pcb, respectively RTHSA,
has to be adjusted to the intended operating mode.
7) TJ = TA + Pdiss * RTHJA. RTHJA = RTHJS + RTHSA.
RTHJA is the thermal resistance between the transistor junction J and the ambient A.
RTHJS is the combined thermal resistance of die and package, which is 35 K/W for the BFQ790, see chapter 5.
Preliminary Data Sheet
10
Revision 2.0, 2014-08-26