ICS889872 Datasheet, PDF (9/14 Pages) Integrated Device Technology – DIFFERENTIAL-TO-LVDS BUFFER/DIVIDER W/INTERNAL TERMINATION

ICS889872
DIFFERENTIAL-TO-LVDS BUFFER/DIVIDER W/INTERNAL TERMINATION
PRELIMINARY
Recommendations for Unused Input Pins
Inputs:
LVCMOS Select Pins
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
OUTputs:
LVDS Outputs
All unused LVDS output pairs can be either left floating or
terminated with 100Ω across. If they are left floating, we
recommend that there is no trace attached.
EPAD Thermal Release Path
The EPAD provides heat transfer from the device to the P.C. board.
The exposed metal pad on the PCB is connected to the ground
plane through thermal vias. To guarantee the device’s electrical
and thermal performance, EPAD must be soldered to the exposed
metal pad on the PCB, as shown in Figure 4. For further
information, please refer to the Application Note on Surface Mount
Assembly of Amkor’s Thermally /Electrically Enhance Leadframe
Base Package, Amkor Technology.
SOLDER
PIN
EPAD
SOLDER
PIN
PIN PAD
GROUND PLANE
THERMAL VIA
EXPOSED METAL PAD
(GROUND PAD)
Figure 4. P.C. Board for Exposed Pad Thermal Release Path Example
PIN PAD
IDT™ / ICS™ LVDS BUFFER/DIVIDER W/INTERNAL TERMINATION
9
ICS889872AK REV. A AUGUST 22, 2007