92HD81 Datasheet, PDF (274/279 Pages) Integrated Device Technology – SINGLE CHIP PC AUDIO SYSTEM

92HD81
SINGLE CHIP PC AUDIO SYSTEM, CODEC+SPEAKER AMPLIFIER+CAPLESS HP+LDO
9. PACKAGE OUTLINE AND PACKAGE DIMENSIONS
Package dimensions are kept current with JEDEC Publication No. 95Solder Reflow Profile
9.1. 48-Pad QFN Package
QFN Dimensions in mm
Key
Min
Nom
Max
A
0.80
0.90
1.0
A1
0.00
0.02
0.05
A3
0.20 REF
D
7.00 BSC
D1
5.50 BSC
E
7.00 BSC
E1
5.50 BSC
L
0.35
0.40
0.45
e
0.50 BSC
R
0.20-0.25
b
0.18
0.25
0.30
D2
5.50
5.65
5.80
E2
5.50
5.65
5.80
ZD
0.75 BSC
ZE
0.75 BSC
Additional
Approved
Option
Figure 13. 48QFN Package Diagram
IDT CONFIDENTIAL
274
©2009 INTEGRATED DEVICE TECHNOLOGY, INC.
V 0.995 01/11
92HD81