7005S55PFG Datasheet, PDF(2/21 Page) Integrated Device Technology

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7005S55PFG Datasheet, PDF (2/21 Pages) Integrated Device Technology – HIGH-SPEED 8K x 8 DUAL-PORT STATIC RAM

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IDT7005S/L

High-Speed 8K x 8 Dual-Port Static RAM

Military, Industrial and Commercial Temperature Ranges

Description

The IDT7005 is a high-speed 8K x 8 Dual-Port Static RAM. The

IDT7005 is designed to be used as a stand-alone 64K-bit Dual-Port RAM

or as a combination MASTER/SLAVE Dual-Port RAM for 16-bit-or-more

word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach

in 16-bit or wider memory system applications results in full-speed, error-

free operation without the need for additional discrete logic.

This device provides two independent ports with separate control,

address, and I/O pins that permit independent, asynchronous access for

reads or writes to any location in memory. An automatic power down

feature controlled by CE permits the on-chip circuitry of each port to enter

a very low standby power mode.

Fabricated using CMOS high-performance technology, these de-

vices typically operate on only 750mW of power. Low-power (L) versions

offer battery backup data retention capability with typical power consump-

tion of 500ÂµW from a 2V battery.

The IDT7005 is packaged in a ceramic 68-pin PGA, 68-pin quad

flatpack, 68-pin PLCC and a 64-pin thin quad flatpack, (TQFP). Military

grade product is manufactured in compliance with the latest revision of MIL-

PRF-38535 QML making it ideally suited to military temperature applica-

tions demanding the highest level of performance and reliability.

Pin Configurations(1,2,3)

11/16/01

INDEX

I/O2L

I/O3L

I/O4L

I/O5L

GND

I/O6L

I/O7L

VCC

GND

I/O0R

I/O1R

I/O2R

VCC

I/O3R

I/O4R

I/O5R

I/O6R

9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61

IDT7005J or F

J68-1(4)

F68-1(4)

68 Pin PLCC / FLATPACK

Top View(5)

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

A5L

A4L

A3L

A2L

A1L

A0L

INTL

BUSYL

GND

M/S ,

BUSYR

INTR

A0R

A1R

A2R

A3R

A4R

2738 drw 02

11/16/01

INDEX

NOTES:

1. All VCC pins must be connected to power supply.

2. All GND pins must be connected to ground supply.

3. J68-1 package body is approximately .95 in x .95 in x .12 in.

F68-1 package body is approximately .97 in x .97 in x .08 in.

PN64 package body is approximately 14mm x 14mm x 1.4mm.

4. This package code is used to reference the package diagram.

5. This text does not indicate oriention of the actual part-marking